Ethynyl-Containing Aromatic Polyamide Resin.
Patent, Filed 16 Sep 86, Patented 21 Jun 88,
DEPARTMENT OF THE AIR FORCE WASHINGTON DC
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This invention relates to novel polymeric compounds and to a method for their synthesis. In particular, this invention relates to novel ethynyl- substituted aromatic polyamides. Interest in laminates and laminating processes for use in a wide variety of industrial applications has increased considerably in the past few years. Glass fiber laminates, for example, find wide use as structural materials because of their lightweight, high relative strength, and high resistance to corrosion and other damaging effects encountered in an environment subject to extreme fluctuations in temperature and weather. It is an object of the present invention to provide novel aromatic polyamide resins which can be cured without evolving volatile side products. Other objects, aspects and advantages of the invention will be readily apparent to those skilled in the art from the following detailed disclosure of the invention.