Manual Microcircuit Die Test System.
Patent Application, Filed 27 Oct 88,
DEPARTMENT OF THE ARMY WASHINGTON DC
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A system for testing semiconductor microchips is provided in which individual microchips can be tested electrically and under specific thermal conditions simultaneously to determine the reliability of the microchip under operating conditions. This system is unique and economically operable so as to enable all individual chips to be tested prior to mounting in larger assemblies. Patent applications. RH
- Test Facilities, Equipment and Methods
- Electrical and Electronic Equipment
- Solid State Physics