Low Modulus Damping Film.
Patent, Filed 3 Jun 86, patented 5 Jan 88,
DEPARTMENT OF THE AIR FORCE WASHINGTON DC
Pagination or Media Count:
A film is disclosed which will accommodate high shear strain in a rigidly supported epoxy impregnated niobium stannide superconducting coil SCC. In a generator application the SCC is subjected to a combined load due to differential thermal contraction, magnetic, and centrifugal forces. These strains could lead to coil fracture and resulting degradation of the field and current-carrying properties. A low modulus material at the interface between the SCC and support structure will reduce or distribute the shear strain to an acceptable level, i.e., no degradation in current carrying properties. Two film materials, polyethylene terephthalate Mylar DuPont Chemical and polycarbonate Makrofol KG Mobay chemical are disclosed as suitable damping or interface films. An adhesive such as the polyurethane Bostik 7070 is used for affixing the film to the winding surface.
- Polymer Chemistry
- Inorganic Chemistry