Method for Fabricating Superconducting Weak-Links Using Electron Beam Lithography.
Patent, Filed 11 Jan 82, patented 2 Jul 85,
DEPARTMENT OF THE NAVY WASHINGTON DC
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A method for fabricating indium variable thickness superconducting microbridges uses a single layer of electron resist and EBL to draw a mask which has a gap with a small amount of undercut. A thin layer of material is deposited at normal incidence to form the bridge and material deposited at a sufficiently large oblique angle forms the banks separately. Typical VTBs have bridges 1000 A thick and 0.4 micrometers long with the banks 7 micrometers thick and R sub n approx. O.1 omega. The method can also form other non-hysteretic weak links such as the SNS junction. Author
- Solid State Physics
- Electricity and Magnetism
- Particle Accelerators