Hermetic Chip Carrier Compliant Soldering Pads.
DEPARTMENT OF THE AIR FORCE WASHINGTON DC
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Compliant soldering pads allow for expansion and contraction between an hermetic chip carriers HCC and printed wiring boards PWB due to coefficient of thermal expansion mismatch and prevent solder cracking which in turn causes electrical discontinuities. The pads allow for flexing in three axes. Patents
- Couplers, Fasteners and Joints
- Electrical and Electronic Equipment