Accession Number:

ADD012759

Title:

Hermetic Chip Carrier Compliant Soldering Pads.

Descriptive Note:

Patent,

Corporate Author:

DEPARTMENT OF THE AIR FORCE WASHINGTON DC

Personal Author(s):

Report Date:

1987-02-03

Pagination or Media Count:

5.0

Abstract:

Compliant soldering pads allow for expansion and contraction between an hermetic chip carriers HCC and printed wiring boards PWB due to coefficient of thermal expansion mismatch and prevent solder cracking which in turn causes electrical discontinuities. The pads allow for flexing in three axes. Patents

Subject Categories:

  • Couplers, Fasteners and Joints
  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE