Accession Number:

ADD012662

Title:

Non-Destructive Semiconductor Chip Bonding and Chip Removal.

Descriptive Note:

Patent Application,

Corporate Author:

DEPARTMENT OF THE ARMY WASHINGTON DC

Personal Author(s):

Report Date:

1987-01-09

Pagination or Media Count:

17.0

Abstract:

An arrangement and method for mounting IC chips or dice onto substrates comprises the use of a pair of electrically conductive electrodes placed on a substrate below the location where the IC chip is to be mounted. The electrodes are separated a distance that is approximately equal to the width of the IC chip to be mounted. A resistor material is disposed between the electrodes, or may even be integral therewith. The IC chip is placed above the resistor material, it is insulated from the latter, and it abuts a layer of bonding material e.g., eutectic solder or epoxy on its underside. A voltage applied to the electrodes heats the resistor material which, in turn melts or cures the bonding material to thereby secure the IC chip in place on the substrate. Patent Application

Subject Categories:

  • Electrical and Electronic Equipment
  • Manufacturing and Industrial Engineering and Control of Production Systems
  • Crystallography

Distribution Statement:

APPROVED FOR PUBLIC RELEASE