Elevated Transient Temperature Leak Test for Unstable Microelectronic Packages.
DEPARTMENT OF THE AIR FORCE WASHINGTON DC
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A novel method and apparatus for detecting leaks in glass-to-metal seals of microelectronic devices and the like are described which comprise a double-gasketed vacuum station including a base plate having a central hole an a first gasket for exposing one side of the seals to a leak detector a vacuum fixture surrounding athe device provides a marginal region therearound which can be evacuated to prevent helium from permeating the first gasket the vacuum fixture includes a central opening to expose the other side of the seals to a helium containing atmosphere within a shroud enclosing the device and vacuum fixture a second gasket provides a seal between the vacuum fixture and device periphery at the central opening in the fixture. For leak tests under controlled timetemperature conditions, an adjacent infrared lamp is used to radiantly heat the package containing the glass-to-metal seals, and a mask is included to avoid direct radiant heating of the gaskets and glass-to-metal seals.
- Electrical and Electronic Equipment
- Test Facilities, Equipment and Methods