Fabrication of Submicron-Wide Lines with Shadow Depositions.
DEPARTMENT OF THE NAVY WASHINGTON DC
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A method of fabricating lines of submicron width, comprising the steps of providing a substrate, depositing a first layer of metal upon the substrate spinning a photoresist layer on the metal patterning the photoresist layer etching the metal to undercut the photoresist edge, e.g. with a mixture for approximately ten minutes at room temperature depositing a second layer of metal at an angle 01 to the photoresist edge, thereby defining a long, submicron-wide opening to the underlying substrate depositing a chosen material, for example, metallic or semiconductor, for the bridge onto the substrate at an angle of 02 through the submicron-wide opening and removing undesired material surrounding the bridge by dissolving the photoresist in hot acetone followed by stripping the remaining two layers of metal with etchant. Author
- Electrooptical and Optoelectronic Devices
- Test Facilities, Equipment and Methods
- Electricity and Magnetism