Method and Apparatus for Dispersive Signal Processing.
DEPARTMENT OF THE ARMY WASHINGTON DC
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The invention is an improved manufacturing technique for producing a certain class of Surface Acoustic Wave SAW devices, namely those having input and output transducers in close proximity. A much higher manufacturing yield results from eliminating the cutting of a slot in the substrate between input and output transducers as formerly done. This frequently destructive step is replaced by ion-milling of a deep groove between the ports and backfilling with a metal of proper configuration to provide electromagnetic shielding. The technique produces a new device that is at least equal to the prior art in rejection of unwanted couplings between input and output. Author
- Line, Surface and Bulk Acoustic Wave Devices
- Radiofrequency Wave Propagation