Accession Number:

ADD009545

Title:

Multilayler Via Resistors.

Descriptive Note:

Patent,

Corporate Author:

DEPARTMENT OF THE ARMY WASHINGTON DC

Personal Author(s):

Report Date:

1981-11-10

Pagination or Media Count:

4.0

Abstract:

A substrate has two or more conductive layers deposited thereon, each adjacent layer pair separated by a dielectric layer. Aperture are formed in the dielectric layer and are filled with resistor paste. In this way, a resistive path may be formed between the conductive layers. This concept of fabricating resistors are particularly useful in the inclusion of pull-up, pull-down and other non-critical resistors in the circuitry contained within a thick film construction. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE