Accession Number:

ADD008603

Title:

A Wedge Assembly.

Descriptive Note:

Patent Application,

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON DC

Personal Author(s):

Report Date:

1980-05-14

Pagination or Media Count:

8.0

Abstract:

A wedge assembly for securing a circuit board in an electronic package gives positive surface contact and excellent heat transfer between the multi-layer board and the electronic package as well as positive lock under vibration and shock. A housing, which may be mounted on a multi-layer board, contains a wedge member having two ramped ends within an open cavity having a single ramped end. Means such as a ramped anvil which slides within the cavity under force from a screw is provided within the cavity for adjusting the wedge member relative to the housing to provide positive contact between the electronic package and the multi-layer board. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE