High Temperature-Resistant Conductive Adhesive and Method Employing Same.
DEPARTMENT OF THE AIR FORCE WASHINGTON DC
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The present invention resides in a high temperature-resistant, conductive adhesive composition for bonding a semiconductor die to a substrate. Broadly speaking, the composition comprises a mixture of an alloy of gallium-tin eutectic and gold and a polyimide resin. More specifically, the composition comprises an alloy containing about 20 to 80 weight percent of gallium-tin eutectic and about 80 to 20 weight percent gold, based on a total of 100 weight percent, and about 1 to 10 weight percent polyimide resin, based upon the weight of the alloy. As is well known, the gallium-tin eutectic contains 89 weight percent gallium and 11 weight percent tin.
- Adhesives, Seals and Binders