Accession Number:

ADD007980

Title:

High Temperature-Resistant Conductive Adhesive and Method Employing Same.

Descriptive Note:

Patent,

Corporate Author:

DEPARTMENT OF THE AIR FORCE WASHINGTON DC

Personal Author(s):

Report Date:

1980-11-11

Pagination or Media Count:

3.0

Abstract:

The present invention resides in a high temperature-resistant, conductive adhesive composition for bonding a semiconductor die to a substrate. Broadly speaking, the composition comprises a mixture of an alloy of gallium-tin eutectic and gold and a polyimide resin. More specifically, the composition comprises an alloy containing about 20 to 80 weight percent of gallium-tin eutectic and about 80 to 20 weight percent gold, based on a total of 100 weight percent, and about 1 to 10 weight percent polyimide resin, based upon the weight of the alloy. As is well known, the gallium-tin eutectic contains 89 weight percent gallium and 11 weight percent tin.

Subject Categories:

  • Adhesives, Seals and Binders

Distribution Statement:

APPROVED FOR PUBLIC RELEASE