Bonded Grid-Cathode Electrode Structure.
DEPARTMENT OF THE ARMY WASHINGTON DC
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A variety of technologies have been applied in the development of a bonded grid cathode. Erosion lithography is used for making the fine-detail grid structure, combining air erosion and lithographic techniques. To obtain openings of the order of 0.001 inch one mil or smaller, a nozzle with a high aspect ratio exit opening is used, and the cathode grid structure in scanned. A photo resist in which the grid pattern is developed is used over the molybdenum or tungsten grid film. The metal film is removed from the grid openings by chemical etching. The photo resist over the metal grid is used as a composite mask for removing the BN insulation in the openings by erosion with Al2O3 powder from the special nozzle on the air blast gun. Author
- Electrical and Electronic Equipment