Improved Method of Infrared Laser Soldering.
DEPARTMENT OF THE NAVY WASHINGTON DC
Pagination or Media Count:
A method and apparatus for attaching miniaturized chip components to substrates is provided. The output of a 1.06 micron wavelength laser is aperturned or attenuated and the attenuated energy is monitored before passing through a cylinder lens which focuses and directs the energy to the intersection of the chip component and the substrate pad so that heat travel in the material is limited and soldering of narrow capacitor or component widths is permitted. Author
- Lasers and Masers
- Manufacturing and Industrial Engineering and Control of Production Systems