Individual Lead Pull Test for Beam Leaded Devices.
DEPARTMENT OF THE ARMY WASHINGTON DC
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The present technology involving the testing of beam-lead devices deals with the push-off testing of the entire bonding of the multiplicity of leads at one time. This technology involves the use of a special substrate arranged such that a hole is directly under the bonded beam-lead device in order to allow the push-off test to be accomplished. In accordance with this invention, a method for destructive testing of beam-leaded devices is provided in which a ceramic chip of a beam-leaded integrated circuit is cut with a laser to segment a portion of the ceramic chip with each individual beam-lead, then cutting a hole with the laser through each individually cut chip section and then attaching a hook of a gram pull tester in the hole of each individual chip section and pulling on the tester until the bond between the individual beam lead and the conductor to which each individual beam lead is connected is broken or the beam lead itself is broken to test the bond strength of each individual beam-lead to its respective conductor. In this manner, the bond strength of each individual beam-lead to its respective conductor is accurately tested to determine the sufficiency of the bond strength of each individual lead.
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