Accession Number:

ADD005974

Title:

Three Dimensional Integrated Circuits.

Descriptive Note:

Patent Application,

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s):

Report Date:

1979-02-21

Pagination or Media Count:

11.0

Abstract:

Three dimensional integrated circuits are manufactured from compatible cofireable materials by extruding batched cofireable materials to form blocks of specified cross sections, selecting and stacking cross sections of various widths from different blocks in a specified manner to form the desired circuit and placing the stack in a furnace having a predetermined temperature time profile to properly sinter each of the materials. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE