Accession Number:

ADD005855

Title:

Solventless Amine Epoxy Resin System.

Descriptive Note:

Patent Application,

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON D C

Report Date:

1977-07-22

Pagination or Media Count:

14.0

Abstract:

A solventless amine-epoxy resin system which is made up of 1 a binary aromatic amine mixture of 2,6-diaminopyridine and meta-phenylene diamine in a weight ratio of from about 14 to about 41 and 2 an epoxy mixture of a the diglycidyl ether of bisphenol A, and b 1,4-butanediol diglycidyl ether in an amount sufficient to reduce the initial viscosity of the total amine-epoxy resin system to a value in the range of from about 500 to about 2000 cps at 25 C. The amount of aromatic amine mixture present in the amine-epoxy resin system is from about 0.90 to about 1.10 times the stoichiometric amount necessary to cure the epoxy mixture. The amine-epoxy resin systems of the present invention are used as the matrix for filament wound rocket and missile cases. Author

Subject Categories:

  • Plastics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE