Accession Number:

ADD005833

Title:

Process for Bonding with Polyethylene Encapsulant.

Descriptive Note:

Patent Application,

Corporate Author:

DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s):

Report Date:

1978-10-28

Pagination or Media Count:

15.0

Abstract:

A process for producing a bond at the interface between an encapsulant and the object to be encapsulated is provided. A selected resin with curing agent is coated and oven cured on the object to be encapsulated and thereafter a copolymer coating is applied to the assembly in a fluidized bed and the assembly is oven cured. The resulting product is then injection molded with a suitable polyethylene material. Author

Subject Categories:

  • Plastics
  • Manufacturing and Industrial Engineering and Control of Production Systems

Distribution Statement:

APPROVED FOR PUBLIC RELEASE