Process for Bonding with Polyethylene Encapsulant.
DEPARTMENT OF THE NAVY WASHINGTON D C
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A process for producing a bond at the interface between an encapsulant and the object to be encapsulated is provided. A selected resin with curing agent is coated and oven cured on the object to be encapsulated and thereafter a copolymer coating is applied to the assembly in a fluidized bed and the assembly is oven cured. The resulting product is then injection molded with a suitable polyethylene material. Author
- Manufacturing and Industrial Engineering and Control of Production Systems