Accession Number:
ADD005408
Title:
Deflagrative Electronic Component Potting Compound.
Descriptive Note:
Patent,
Corporate Author:
DEPARTMENT OF THE NAVY WASHINGTON D C
Personal Author(s):
Report Date:
1978-07-18
Pagination or Media Count:
2.0
Abstract:
A potting compound is described, comprising a low viscosity and low temperature curing silicone resin, potassium perchlorate, magnesium and boron, for encapsulating electronic equipment and assemblies and which can be used for destroying the electronic components in emergency situations.
Descriptors:
Subject Categories:
- Plastics