Method for Making Beam Leads for Ceramic Substrates.
DEPARTMENT OF THE NAVY WASHINGTON D C
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The patent application describes a method for making beam leads for use in the interconnecting of electronic devices and packages. A first metal is deposited onto a substrate which has poor adhesion with the substrate. A portion of the deposited metal is then etched away leaving on said substrate deposited metal at locations where a second metal is not to adhere to the substrate. Then depositing onto said substrate and over said first deposited metal a plurality of beam leads of a second metal. Then lifting said portions of said first metal from said substrate and then etching away said first metal to provide beam leads partially attached to said substrate.
- Electrical and Electronic Equipment