Fluid Flow Stripping and Plating System.
DEPARTMENT OF THE AIR FORCE WASHINGTON D C
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The patented system comprises at least one device which includes an electrode and a fluid cavity both extending the longitudinal length of the circuit board adjacent to the portion of the board involved. Ordinarily, the terminal contacts along one edge of the board are to be stripped of, for example, tin-lead solder or plated with, for example, gold. The portion of the board to be plated or stripped, is made the other electrode. The electrode of the device is spaced from the contacts so that the fluid from the cavity flows evenly over the surface of the contact pads. Current passes from the electrode through the fluid to the board surface to either strip or plate, depending on the application of the system. The polarities of the electrodes are reversed for plating and stripping and the solution is changed.
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