Electroless Deposition of Copper and Copper-Tin Alloys.
DEPARTMENT OF THE ARMY WASHINGTON D C
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The patent relates to electroless bath compositions for the deposition of copper or copper-tin alloys, said baths being devoid of formaldehyde or potassium heptagluconate and having less alkalinity than prior art baths, said baths providing highly adherent deposits to such substrates as steel, for example, and consisting of Copper sulfate.5H2O, Di-sodium salt of Ethylenediamine tetra-acetic acid.2H2O, Ammonium hydroxide 28 percent NH3, Dimethylamine borane, and, if a copper-tin alloy deposit is desired, stannous chloride.2H2O.
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