Hot Pressed, High Strength Silicon Nitride.
DEPARTMENT OF THE ARMY WASHINGTON D C
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The patent relates to the fabrication of high strength, high density, silicon nitride by the addition of between 1.0 to 3.5 percent by weight of yttrium in the form of a compound to silicon nitride powder and pressing the material at temperatures of between 1,750C. and 1,800C. and at uniaxial pressures of between 6,000 and 7,000 psi.
- Ceramics, Refractories and Glass