Accession Number:

ADB211506

Title:

Multifunctional Structural Electronics Packaging.

Descriptive Note:

Final rept. Apr-Dec 95,

Corporate Author:

APPLIED MATERIAL TECHNOLOGIES INC SANTAANA CA

Personal Author(s):

Report Date:

1995-12-01

Pagination or Media Count:

41.0

Abstract:

This project demonstrated the feasibility of developing a highly integrated multifunctional component that would enable Multichip Modules MCMs to be mounted directly to the surface of a spacecraft panel. The benefits of this concept over conventional black box technology are 90 weight savings, 90 volume savings, 70 surface area savings, better thermal path for waste heat rejection, and elimination of extensive amounts of cabling. This concept for packaging is essential if small spacecraft are going to be developed and deployed. 500 kgs spacecraft that require high levels of electronic data processing cannot be developed using conventional black box technology the new millenium spacecraft require this technology to achieve the mission goals. The results demonstrated that a multifunctional component that has the correct CTE, high thermal conductivity, high stiffness, and lightweight can be manufactured.

Subject Categories:

  • Electrical and Electronic Equipment
  • Unmanned Spacecraft

Distribution Statement:

APPROVED FOR PUBLIC RELEASE