Accession Number:

ADB021841

Title:

Cure Monitoring Techniques for Adhesive Bonding Processes

Descriptive Note:

Final rept. 15 Apr 1976-17 Jan 1977

Corporate Author:

LOCKHEED MISSILES AND SPACE CO INC SUNNYVALE CA

Report Date:

1977-03-01

Pagination or Media Count:

97.0

Abstract:

Dielectric monitoring was successfully applied to the adhesive bonding process for structural aerospace adhesives. Of the three methods investigated, the one best suited for production applications was demonstrated for flat adherends of various substrates and aluminum honeycomb panels. A monitoring technique which uses a foil probe embedded in the bondline permits multipoint cure monitoring in a single bondline. Effects of the probe on bondline strength were determined.

Subject Categories:

  • Adhesives, Seals and Binders
  • Fabrication Metallurgy
  • Test Facilities, Equipment and Methods

Distribution Statement:

APPROVED FOR PUBLIC RELEASE