Exploratory Development of Processable Laminating Resins with Improved Toughness and Moderate Temperature Capability. Volume 3, Phase 2 and 3
Final rept. 1 Jun 1974-30 Sep 1975
TRW SYSTEMS GROUP REDONDO BEACH CA
Pagination or Media Count:
Resin optimization studies and adhesive development work were continued with the DONA polyimide resin developed under Phase I of this program. Objectives of the Phase II and III studies during this twelve-month period were to identify a lower boiling solvent than DMF or NMP and to develop an adhesive using the DONA polyimide resin. The PMR approach polymerization of monomeric reactants was evaluated as a route to obtaining resin stability in low boiling solvents. It was demonstrated that the use of DMF is key to obtaining sufficient imidization prior to cure at 400 F. Attempts to develop an adhesive using the DONA polyimide resin were unsuccessful.
- Adhesives, Seals and Binders
- Laminates and Composite Materials