Accession Number:
ADA636437
Title:
An Affordable, Two-Dimensional, High-Resolution Acoustic Imaging Array
Descriptive Note:
Technical memo.
Corporate Author:
NAVAL UNDERSEA WARFARE CENTER DIV NEWPORT RI
Personal Author(s):
Report Date:
1997-08-01
Pagination or Media Count:
26.0
Abstract:
The design, fabrication, and measured results for a prototype, two-dimensional, ultrasonic imaging array are described. The active sensor consists of virtually three layers 1 a piezoelectric 1-3 composite layer, 2 a flex-circuit component, and 3 a special adhesive that joins them. The sensor construction utilizes electroplated, injection-molded 1-3 piezocomposite as the active layer. Four multi-layer, acoustically thin flex-circuits provide the electrical connections required for addressing the 468 individual array elements. Of key importance to the fabrication process is the use of a composite, B-stage, adhesive film layer that combines both conductive and non-conductive regions in a pattern-specific orientation within the plane comprising the bond line interface. The conductive regions of the adhesive film are registered with respect to the electroplated sections on both the flex-circuit and the 1-3 piezocomposite substrate. The transducer array is a reciprocal device operable in both transmit and receive modes. Measured results include individual element and array calibrations i.e., receive responses, beam patterns, and relative phase.
Descriptors:
- *ACOUSTIC ARRAYS
- ADHESION
- ADHESIVES
- ARRAYS
- BONDED JOINTS
- CALIBRATION
- CONDUCTIVITY
- CONSTRUCTION
- DETECTORS
- ELECTRIC CONNECTORS
- ELECTROPLATING
- FABRICATION
- FILMS
- HIGH RESOLUTION
- IMAGES
- INJECTION MOLDING
- INTERFACES
- LAYERS
- PIEZOELECTRIC MATERIALS
- PROTOTYPES
- RADIATION PATTERNS
- REGIONS
- RESPONSE
- SONOGRAMS
- THINNESS
- TRANSDUCERS
- TWO DIMENSIONAL
Subject Categories:
- Electrical and Electronic Equipment