Accession Number:
ADA621850
Title:
Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder
Descriptive Note:
Final rept. 2010-2015
Corporate Author:
STATE UNIV OF NEW YORK AT BINGHAMTON
Personal Author(s):
Report Date:
2015-05-05
Pagination or Media Count:
169.0
Abstract:
A systematic study of the formation and evolution of realistic lead free solder microstructure and the associated deformation properties led to a general materials science based understanding and the development of constitutive laws for selected alloys. A range of different testing of both assemblies and individual solder joints provides for correlations with the microstructure and the definition of different damage functions for isothermal and thermal cycling. Experiments were conducted to ensure the applicability of these functions under typical service conditions.
Descriptors:
Subject Categories:
- Properties of Metals and Alloys
- Crystallography
- Solid State Physics