Accession Number:

ADA591769

Title:

Sensei: A Multi-Modal Framework for Assessing Stress Resiliency

Descriptive Note:

Monthly rept. 1-31 Aug 2013

Corporate Author:

SRI INTERNATIONAL SARNOFF CORP PRINCETON NJ

Report Date:

2013-09-01

Pagination or Media Count:

3.0

Abstract:

During this reporting period, we completed development of the regression approach for predicting fingertip-based skin conductance from facial temperature dynamics, and prepared for presentation of the results of this research at the project PI meeting.

Subject Categories:

  • Anatomy and Physiology
  • Stress Physiology

Distribution Statement:

APPROVED FOR PUBLIC RELEASE