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Stencil Mask Methodology for the Parallelized Production of Microscale Mechanical Test Samples (Preprint)
Technical paper 1 Jul-1 Aug 2012
AIR FORCE RESEARCH LAB WRIGHT-PATTERSON AFB OH STRUCTURAL MATERIALS DIV
Pagination or Media Count:
A new methodology to parallelize the production of micromechanical test samples from bulk materials is reported. This methodology has been developed to produce samples with typical gage dimensions on the order of 20 to 200 microns, and also to reduce the unit-cost-per-sample compared to conventional focused ion beam FIB fabrication methods. The fabrication technique uses standard microelectronic process methods such as photolithography and deep-reactive ion etching DRIE to create high aspect ratio patterned templates -- stencil masks -- from a silicon wafer. In the present work, the stencil mask pattern is a linear row of tensile samples, where one grip of each sample is integrally attached to the bulk substrate. Once fabricated, the stencil mask is placed on top of a pre-thinned substrate, and the pattern and substrate are co-sputtered using a broad ion beam milling system, which ultimately results in the transfer of the mask pattern into the substrate. The methodology is demonstrated using a Si stencil mask and a polycrystalline Ni foil to manufacture an array of metallic micro-tension samples.
APPROVED FOR PUBLIC RELEASE