Accession Number:

ADA561797

Title:

Micro-Stirling Active Cooling Module (MS/ACM) for DoD Electronics Systems

Descriptive Note:

Conference paper

Corporate Author:

BECK ENGINEERING INC PORT ORCHARD WA

Personal Author(s):

• Beck, Douglas S.

Report Date:

2012-03-01

Pagination or Media Count:

4.0

Abstract:

The Department of Defense has many systems that can benefit from the features of a cm-scale microrefrigerator. We are developing for DARPA a cm-scale Micro-Stirling Active Cooling Module MSACM microrefrigerator to benefit the DoD systems. Under a DARPA contract, we are designing, building, and demonstrating a breadboard MSACM.

Descriptors:

• *COOLING
• *ELECTRONIC EQUIPMENT
• BREADBOARD MODELS
• CONTRACTS
• ELECTRONICS
• MODULAR CONSTRUCTION
• REFRIGERATION SYSTEMS
• SUBMINIATURE ELECTRICAL EQUIPMENT
• SYMPOSIA

Subject Categories:

• Electrical and Electronic Equipment
• Air Conditioning, Heating, Lighting and Ventilating

Distribution Statement:

APPROVED FOR PUBLIC RELEASE