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Atom Chips on Direct Bonded Copper Substrates (Postprint)
Interim rept. 3 Apr 2005-31 Mar 2011
AIR FORCE RESEARCH LAB KIRTLAND AFB NM SPACE VEHICLES DIRECTORATE
Pagination or Media Count:
We present the use of direct bonded copper DBC for the straightforward fabrication of high power atom chips. Atom chips using DBC have several benefits excellent coppersubstrate adhesion, high purity, thick greater than 100 microns copper layers, high substrate thermal conductivity, high aspect ratio wires, the potential for rapid less than 8 h fabrication, and three-dimensional atom chip structures. Two mask options for DBC atom chip fabrication are presented, as well as two methods for etching wire patterns into the copper layer. A test chip, able to support 100 A of current for 2 s without failing, is used to determine the thermal impedance of the DBC. An assembly using two DBC atom chips is used to magnetically trap laser cooled 87Rb atoms. The wire aspect ratio that optimizes the magnetic field gradient as a function of power dissipation is determined to be 0.841 heightwidth.
APPROVED FOR PUBLIC RELEASE