Micromechanical Sensor for the Spectral Decomposition of Acoustic Signals
ARMY RESEARCH DEVELOPMENT AND ENGINEERING COMMAND REDSTONE ARSENAL AL
Pagination or Media Count:
This technical report is duplicative documentation of the approved doctorial thesis of one of the co-authors. The research was funded in part by the U.S. Army Aviation and Missile Research, Development, and Engineering Center AMRDEC for the development of micromechanical sensors under the Army Technology Objective ATO of Sensor, Warhead, and Fuzing Technology Integrated for Combined Effects SWFTICE. Particular technical progress at AMRDEC within this report includes resonant array processing Chapter 3, electrets integration with Microelectromechanical Systems MEMS with localized heater fabrication for wafer bonding and microcharging grids for in-situ charging using microcoronas Chapter 4, and processing of MEMS transducers Chapter 5.
- Electrical and Electronic Equipment