Accession Number:

ADA532695

Title:

MEMS For Rolling-Element Bearings

Descriptive Note:

Final rept. 1 Mar 2005-30 Apr 2010

Corporate Author:

TIMKEN CORP CANTON OH

Report Date:

2010-01-01

Pagination or Media Count:

121.0

Abstract:

Improvement of the operating characteristics of rolling-element bearings was sought through development and implementation of MEMS Micro Electro-Mechanical System based strain sensors. The strain sensors developed in this program employ a piezoresistive transducer to convert changes in applied strains to output voltages with an on-chip temperature detector compensating for thermal effects in the strain measurement. Bonding of MEMS strain sensors to application substrates was accomplished with induction heating using a wafer-level deposition process to pre-coat AuSn eutectic alloy on the MEMS chips and a process to pre-coat steel substrates with a NiAu layer. A flexible-circuit board and a back-fill process were also developed for connecting MEMS strain sensors to signal-conditioning electronics. A wafer-level gold bumping process was used to place gold bumps on the MEMS chip solder pads and a thermo-ultrasonic bonding flip-chip technique was developed to bond the MEMS strain sensors to the flexible-circuit board. Performance evaluation of MEMS strain sensors was accomplished with the development of several high-precision test systems. For quick installation of MEMS strain sensors on application structures, a low-cost bolt-on displacement sensor and associated electronics were developed. Their usefulness was demonstrated on a public bridge structure using Timkens StatusCheck 2.4 wireless data collection system.

Subject Categories:

  • Electrical and Electronic Equipment
  • Fabrication Metallurgy
  • Manufacturing and Industrial Engineering and Control of Production Systems
  • Machinery and Tools

Distribution Statement:

APPROVED FOR PUBLIC RELEASE