Power MEMS Development
Monthly status rept. 1-31 Aug 2010
SRI INTERNATIONAL MENLO PARK CA PHYSICAL SCIENCES DIV
Pagination or Media Count:
MEMS Resettable Circuit Breaker TASK 1.1 and MEMS Switch for DC-DC Voltage Converters TASK 1.2 In Task 1.1 we wafer-bonded a silicon-on-insulator SOI wafer and a double-side polished DSP silicon wafer, then released and tested devices from this bonded wafer pair. After release, we determined that the cantilever devices forming the circuit breaker switch were in a normally closed position due to high intrinsic stress in the thin-film layers. We measured the resistance of heater elements in these devices, which were in agreement with the expected theoretical values. We performed current and voltage testing on the circuit breaker devices and observed the thermal operation of the switches. Further plans for device processing include reducing the impact of the intrinsic stress in the thin films and producing normally open switches. In Task 1.2 we identified design issues in the Version 2.0 V2.0 device design following flipchip bonding experiments. The V2.0 design was designed to tolerate bonding misalignment, whereas experimental results show flip-chip bonding misalignment. Because of this larger misalignment, devices on bonded chips do not actuate as expected following bonding. We redesigned the layout of metal layers in two of the device masks to accommodate this higher level of flip-chip misalignment while still providing device actuation. Devices using this new V2.1 design will be fabricated and tested next month.
- Electrical and Electronic Equipment
- Electric Power Production and Distribution
- Electricity and Magnetism