Accession Number:

ADA523570

Title:

Microstructural Response of Pure Copper to Cryogenic Rolling (PREPRINT)

Descriptive Note:

Conference paper

Corporate Author:

RUSSIAN ACADEMY OF SCIENCES UFA INST FOR METALS SUPERPLASTICITY PROBLEMS

Report Date:

2010-04-01

Pagination or Media Count:

27.0

Abstract:

A high-resolution electron-back-scatter-diffraction EBSD technique was applied to quantify grain-structure development and texture evolution duringafter cryogenic rolling of pure copper. Microstructure evolution was found to be a complex process involving mainly geometrical effects associated with strain and discontinuous recrystallization but also including limited twinning and grain subdivision. Recrystallization was deduced to be static in nature and probably occurred during static storage of the material at room temperature after cryogenic rolling. The texture contained a pronounced 110112 brass component this observation was interpreted in terms of the suppression of cross slip at cryogenic temperatures. In general, cryogenic rolling was found to be ineffective for the formation of a nanocrystalline NC structure in pure copper.

Subject Categories:

  • Metallurgy and Metallography

Distribution Statement:

APPROVED FOR PUBLIC RELEASE