Optoelectronic Multichip Module Integration for Chip Level Optical Interconnects
DELAWARE UNIV NEWARK DEPT OF ELECTRICAL AND COMPUTER ENGINEERING
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We have integrated an 850-nm vertical-cavity surface- emitting laser VCSEL, its driver, and a diffractive lenslet array onto a single substrate to produce an integrated optoelectronic multichip module for signal fan-out and distribution. The diffractive element performs optical fan-out of the output beam from the VCSEL into an array of focused spots at a plane 1,416 um from the surface of the VCSEL. This corresponds to 160 um from the surface of the diffractive lens. System design, fabrication, integration, and experimental characterization is presented.
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