Accession Number:

ADA509461

Title:

Diamond/CNT Film Interface for Heat Dissipation in Electronic Devices

Descriptive Note:

Final rept. 18 Mar 2007-17 Mar 2009

Corporate Author:

VIETNAM ACADEMY OF SCIENCE AND TECHNOLOGY HANOI INST OF MATERIALS SCIENCE (VAST)

Personal Author(s):

Report Date:

2009-09-29

Pagination or Media Count:

10.0

Abstract:

Commercial thermal matching media such as thermal grease are normally basing on silver. By adding a suitable amount of the CNTs into the commercial silver paste, it is expected to improve the conductivity and the performance of any high power electronic components such as micro-processor, high power laser, high power LED for lighting, and so on. In this research, CNT materials were successfully functionalized to form CNT-COOH and CNT-C6H4NH2. The functionalized CNTs material was added to a commercially available thermal paste up to 2 and still keeping the sticking properties of the paste. This 2 CNT-thermal paste was shown to reduce the temperature of the micro processor down to 65 deg C, prolong the thermal rise time and work without reducing the CPU performance for more than 10 days in full load and even up to 125 CPU usage mode without exceeding the safe operating temperature. Analytical calculations were carried out and verified with experiment data.

Subject Categories:

  • Electrical and Electronic Equipment
  • Refractory Fibers
  • Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE