Accession Number:

ADA505770

Title:

Toward Three Dimensional Circuits Formed by Molten-Alloy Driven Self-Assembly

Descriptive Note:

Conference paper

Corporate Author:

ARMY RESEARCH LAB ADELPHI MD SENSORS AND ELECTRON DEVICES DIRECTORATE

Personal Author(s):

• Morris, Christopher J.
• Dubey, Madan

Report Date:

2008-12-01

Pagination or Media Count:

6.0

Abstract:

Self-assembly opens new possibilities in three-dimensional 3-D device structures, and here we report on our progress toward a self-assembling 3-D circuit. A major challenge to such a system has been the fabrication of large numbers of free-standing, microfabricated parts, and we have overcome this challenge by developing a new wafer-bond and release process. We present this process on 100 mm diameter wafers, and finally show initial assembly results.

Descriptors:

• *ALLOYS
• *ASSEMBLY
• *THREE DIMENSIONAL
• *CIRCUITS
• MOLTEN SALTS
• WAFERS
• SILICON ON INSULATOR
• FABRICATION
• SYMPOSIA
• RELEASE

Subject Categories:

• Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE