DID YOU KNOW? DTIC has over 3.5 million final reports on DoD funded research, development, test, and evaluation activities available to our registered users. Click HERE
to register or log in.
Toward Three Dimensional Circuits Formed by Molten-Alloy Driven Self-Assembly
ARMY RESEARCH LAB ADELPHI MD SENSORS AND ELECTRON DEVICES DIRECTORATE
Pagination or Media Count:
Self-assembly opens new possibilities in three-dimensional 3-D device structures, and here we report on our progress toward a self-assembling 3-D circuit. A major challenge to such a system has been the fabrication of large numbers of free-standing, microfabricated parts, and we have overcome this challenge by developing a new wafer-bond and release process. We present this process on 100 mm diameter wafers, and finally show initial assembly results.
APPROVED FOR PUBLIC RELEASE