Accession Number:

ADA504550

Title:

Hydrogen Effects on Silicon Microsystems

Descriptive Note:

Final rept. 22 Aug 2006-7 Jul 2009

Corporate Author:

UPPSALA UNIV (SWEDEN) DEPT OF MATERIALS SCIENCE

Personal Author(s):

Report Date:

2009-02-15

Pagination or Media Count:

21.0

Abstract:

This report results from a contract tasking University of Uppsala as follows The proposed work contains two parts, first the ordinary literature survey work with a summary report including conclusions, and second, some experimental work supporting the design of a high pressure check valve. Two test structures are foreseen to be used. 1 A direct fusion bonded wafer samples with different surface activation prior to bonding shall be exposed to high pressure Hydrogen for a significant period of time. After burst test of all samples shall the bonding strength be calculated and a statistical analysis performed. 2 The second test structure shall be used to examine embrittlement of springs in mono crystalline silicon. The stiffness and strength of very small beams shall be measured and analyzed. Two reports will be delivered, a midterm report halfway through the study, and a final data package including a summary report at end of contract. A conference contribution is foreseen to be a part of the final data package.

Subject Categories:

  • Industrial Chemistry and Chemical Processing
  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE