Accession Number:

ADA499154

Title:

Damping MEMS Devices in Harsh Environments Using Active Thin Films

Descriptive Note:

Final rept. 15 May 2004-14 May 2007

Corporate Author:

CALIFORNIA UNIV LOS ANGELES DEPT OF MECHANICAL AND AEROSPACE ENGINEERING

Report Date:

2008-06-17

Pagination or Media Count:

26.0

Abstract:

We report on fabrication and damping measurement of NiTi and Terfenol-D thin films. A model for prediction of the damping properties tan delta of a laminate using the material properties of the layers was developed. Damping properties in Nitinol thin film due only to residual stresses was measured to be as high as tan delta 0.17 for large strain 0.9. At lower strain levels a NitinolSilicon laminate was tested in a cantilever load frame. The damping value of the film was measured to be 0.28 at 0.27 strain. A NitinolTerfenol-DNickel laminate was fabricated and tested in a cantilever loading. The damping value of the film was measured to be 0.2 at 0.27 strain.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE