Disbond Thickness Evaluation Employing Multiple-Frequency Near-Field Microwave Measurements
Journal article (preprint)
MISSOURI UNIV-ROLLA DEPT OF ELECTRICAL AND COMPUTER ENGINEERING
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Near-field microwave nondestructive evaluation NDE techniques have shown great potential for disbond detection in multi-layer dielectric composite structures. The high detection capability associated with these techniques stems from the fact that near-field microwave signals are sensitive to minute variations in the dielectric properties and geometry of the medium in which they propagate. In the past, the sensitivity of the near-field microwave NDE techniques to the presence and properties of disbonds in multi-layer dielectric composites has been investigated extensively. However, a quantitative disbond thickness estimation method has yet to be introduced. In this paper, we propose a maximum-likelihood ML disbond thickness evaluation method utilizing multiple independent measurements obtained at different frequencies. We also introduce a statistical lower limit on the thickness resolution based on the mean squared error MSE in thickness estimation and a given confidence interval. The effectiveness of the proposed ML method is also verified by comparing simulation results with actual measurements.
- Couplers, Fasteners and Joints
- Test Facilities, Equipment and Methods