Textured Copper Metallic Substrates for 2nd Generation High Temperature Superconductor Applications
AIR FORCE RESEARCH LAB WRIGHT-PATTERSON AFB OH PROPULSION DIRECTORATE
Pagination or Media Count:
Sharp cube textured Cu 100 tapes have been produced as a possible substrate for epitaxially grown conductive, intermediate metallic or ceramic buffer layers with subsequent deposition of high critical current density YBa2Cu307-x YBCO films. Cu substrates were fabricated from rods and foils by smooth cold rolling followed by recrystallization. Detailed x-ray diffraction XRD studies along with orientation imaging microscopy were performed to measure the inplane alignment, out-of-plane alignment and microtexture for different annealing temperatures. The best full width half-maximum FWHM values of 5.4 deg for in-plane alignment and 5.8 deg for out-of-plane alignment were obtained at 750 deg C annealing temperature. Microtexture results indicate more than 97.5 of grains have less than 10 deg misorientation.
- Laminates and Composite Materials
- Metallurgy and Metallography