High Cooling Power Density of SiGe/Si Superlattice Microcoolers
HRL LABS LLC MALIBU CA
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Fabrication and characterization of SiGeSi superlattice microcoolers integrated with thin film resistors are described. Superlattice structures were used to enhance the device performance by reducing the thermal conductivity, and by providing selective emission of hot carriers through thermionic emission. Thin film metal resistors were integrated on top of the cooler devices and they were used as heat load for cooling power density measurement. Various device sizes were characterized. Net cooling over 4.1 K and a cooling power density of 598 Wcm2 for 40 x 40 mm2 devices were measured at room temperature.
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