Accession Number:

ADA458169

Title:

Vibration Testing of Repaired Lead-Tin/Lead-Free Solder Joints (Preprint)

Descriptive Note:

Conference paper preprint

Corporate Author:

MISSOURI UNIV-ROLLA MATERIALS RESEARCH CENTER

Report Date:

2006-02-01

Pagination or Media Count:

9.0

Abstract:

Due to growing environmental concerns and recent legislation, tin-lead Pb-Sn solders are being phased out by lead-free LF solders. The most common Sn-Pb replacement is the tin-silver-copper Sn-Ag-Cu, SAC alloys. During the transition phase, it is expected that there will be a period where both Sn-Pb and LF solders will be used side by side, and in conjunction with one another, during assembly processes. Repaired solder joints may also be expected to contain a mixture of Sn-Pb and LF solders, especially in military systems. Tested printed circuit boards were visually inspected for solder cracking and delamination. Metallographic analysis was done on areas where visible cracking or physical damage had occurred. All vibration testing was done at room temperature.

Subject Categories:

  • Couplers, Fasteners and Joints
  • Mechanics
  • Properties of Metals and Alloys

Distribution Statement:

APPROVED FOR PUBLIC RELEASE