Accession Number:

ADA457206

Title:

Thermomechanical Cycling Investigation of Cu and Niti Reinforced Lead-Free Solder

Descriptive Note:

Master's thesis

Corporate Author:

NAVAL POSTGRADUATE SCHOOL MONTEREY CA

Personal Author(s):

Report Date:

2006-09-01

Pagination or Media Count:

75.0

Abstract:

In today,s Flip Chip FC and Ball Grid Array BGA electronic packages solder joints provide both the electrical as well as the mechanical connections between the silicon chip and the substrate. Due to coefficient of thermal expansion CTE differences between the chip and substrate the solder joints undergo thermomechanical stresses and strains as an electronic package is heated and cooled with power onoff cycles. Advances in chip designs result in chips that are larger, run hotter and demand improved resistance to creep and low-cycle fatigue in the solder joints. In this study the strengthening of these joints with two different reinforcements is explored a hard particulate and a shape memory alloy SMA single fiber composite SFC. A baseline is established with a SnAgCu solder that is then compared to test runs on the same solder matrix with Copper particles and then the SMA, Nickel- Titanium wire as reinforcements.

Subject Categories:

  • Properties of Metals and Alloys

Distribution Statement:

APPROVED FOR PUBLIC RELEASE