Accession Number:

ADA456220

Title:

Sub-Critical Telephone Cord Delamination Propagation and Adhesion Measurements

Descriptive Note:

Conference paper

Corporate Author:

UNIVERSITY OF SOUTH FLORIDA TAMPA DEPT OF MECHANICAL ENGINEERING

Report Date:

2005-01-01

Pagination or Media Count:

6.0

Abstract:

Thin film delamination can occur when the stored elastic energy per unit area in the film due to the residual stress exceeds the interfacial toughness. Telephone cord morphology is commonly observed in delaminating thin films under compressive stresses. Here, the biaxial film stress is partially relieved by film buckling in the direction perpendicular to the telephone cord propagation, and by secondary blister buckling in the direction of telephone cord propagation, which results in the sinusoidal fracture patterns. A superlayer indentation test, in which additional stress is supplied to the crack tip using a nano-indenter, can be used to measure the interfacial toughness. Estimates of the energy release rate for diamond-like carbon DLC films on magnetic media were obtained using the superlayer indentation test, as well as the delaminated buckling profiles. The results obtained by these two independent methods are in good agreement with each other. We find the average adhesion energy to be 6 Jsq m for DLC films on magnetic media.

Subject Categories:

  • Laminates and Composite Materials
  • Non-Radio Communications

Distribution Statement:

APPROVED FOR PUBLIC RELEASE