Accession Number:

ADA456174

Title:

Adhesion Measurements of Thin Films in Corrosive Environments

Descriptive Note:

Final rept.

Corporate Author:

UNIVERSITY OF SOUTH FLORIDA TAMPA DEPT OF MECHANICAL ENGINEERING

Personal Author(s):

Report Date:

2006-09-01

Pagination or Media Count:

16.0

Abstract:

With the use of thin films reaching a wide variety of applications, it is important to know how thin films will hold up in a variety of environmental conditions. Here, water effects on thin film adhesion were studied on copper and diamond like carbon DLC films. Regardless of the film being considered, it is usually advantageous to have a thin film that adheres well to its substrate. Because of the potentially harsh environments that thin films may be introduced to during their processing or use, the effect of water on thin film adhesion need to be further studied. There are several methods currently being used to measure the adhesion of thin films which include the following four-point bend test, indentation, scratch and pull off tests. Here we used the superlayer indentation test for adhesion measurements in the dry environment. For measuring film adhesion in a wet environment a modified version of the superlayer nanoindentation test was developed. Quantitative adhesion tests yield the practical work of adhesion, or strain energy release rate, C, value. When C is greater than the materials resistance to crack growth, F, crack propagation will occur. The formerly stated is the Griffith criterion and can also be applied to interfacial fracture.

Subject Categories:

  • Electrical and Electronic Equipment
  • Adhesives, Seals and Binders

Distribution Statement:

APPROVED FOR PUBLIC RELEASE