Accession Number:

ADA456110

Title:

Stress and Moisture Effects on Thin Film Buckling Delamination

Descriptive Note:

Corporate Author:

UNIVERSITY OF SOUTH FLORIDA TAMPA DEPT OF MECHANICAL ENGINEERING

Personal Author(s):

Report Date:

2006-07-25

Pagination or Media Count:

8.0

Abstract:

Deposition processes control the properties of thin films they can also introduce high residual stresses. which can be relieved by delamination and fracture. Tungsten films with high 1-2 GPa compressive residual stresses were sputter deposited on top of thin below 100 nm copper and diamond-like carbon DLC films. Highly stressed films store large amounts of strain energy. When the strain energy release rate exceeds the films interfacial toughness, delamination occurs. Compressive residual stresses cause film buckling and debonding, forming open channels. Profiles of the buckling delaminations were used to calculate the films interfacial toughness and then were compared to the adhesion results obtained from the superlayer indentttion test. Tests were conducted in both dry and wet environments and a significant drop in film adhesion. up to 100 times was noticed due to the presence of moisture at the filmsubstrate interface.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE