Aerospace Sensor Component and Subsystem Investigation And Innovation-2 Component Exploration and Development (ASCII-2 CED). Delivery Order 0002: Volume 3 - Reconfigurable Aperture Antenna Virtual Prototyping (General Techniques for De-Embedding RF Passive Devices)
Final rept. 30 Mar 2001-31 Mar 2005
OHIO STATE UNIV COLUMBUS DEPT OF ELECTRICAL ENGINEERING
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In this report, a rigorous investigation of the de-embedding of RF inductors and capacitors was presented. The typical parasitic impedances present in an RF test structure were discussed. Basic knowledge of these parasitics allows the designer to effectively adjust the test structures to account for any limitations imposed by the probe technology being used. Some technologies allow traces to be etched at arbitrary angles, making it possible for a coplanar waveguide interconnect to be used, thus minimizing the interconnect impedance.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems
- Radiofrequency Wave Propagation